Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
US7878883B2 · kind B2 · utility
4Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Sep 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.