Patent · US Active

Detection of additive breakdown products in acid copper plating baths

US7879222B2 · kind B2 · utility

4Cited by

2References

9Claims

0Family size

Assignee

ECI TECHNOLOGY, INC.

Inventors

Eugene Shalyt · Hackettstown, US
Michael Pavlov · Kingston, US
Peter Bratin · Great Neck, US

Key dates

Filing date	Aug 27, 2007
Grant date	Feb 1, 2011
Priority date	—
Expiry date	Nov 14, 2029

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D3/38
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

An additive breakdown product in an acid copper plating bath sample is detected by performing a voltammetric analysis for the leveler additive in two measurement solutions comprising different volume fractions of the copper plating bath sample in a background electrolyte. When the plating bath sample contains a substantial concentration of the additive breakdown product, the analyses for the first and second measurement solutions indicate different concentrations for the leveler additive in the plating bath sample. A comparison of the leveler additive concentrations indicated by the two analyses provides a measure of the concentration of the additive breakdown product.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.