Adhesive for bonding circuit members, circuit board and process for its production
US7879445B2 · kind B2 · utility
4Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2007 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Oct 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.