Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon
US7880296B2 · kind B2 · utility
7Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2008 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Mar 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal layer formed by electroplating on the bottom surface and side surfaces of the chip-embedded carrier structure. The metal layer prevents moisture from crossing the side surfaces of the chip-embedded carrier structure, so as to prevent delamination, provide a shielding effect, and improve heat dissipation through the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.