Semiconductor device and method of manufacturing semiconductor device
US7880317B2 · kind B2 · utility
7Cited by
1References
12Claims
0Family size
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Key dates
| Filing date | Oct 30, 2006 |
| Grant date | Feb 1, 2011 |
| Priority date | — |
| Expiry date | Jan 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.