Tomoshi Ohde
7Patents
5h-index
8Co-inventors
52Inventor score
Filing activity: May 12, 1997 → Nov 16, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6514847B1 | Method for making a semiconductor device | Electricity | 153 | Expired |
| US6020626A | Semiconductor device | Electricity | 15 | Expired |
| US7880317B2 | Semiconductor device and method of manufacturing semiconductor device | Electricity | 7 | Active |
| US6838368B1 | Method for making semiconductor device using a nickel film for stopping etching | Electricity | 5 | Expired |
| US6326676A | Semiconductor device | Electricity | 5 | Expired |
| US6368943B1 | Semiconductor method of manufacture | Electricity | 5 | Expired |
| US7436682B2 | Wiring board, electronic component mounting structure, and electronic component mounting method | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.