Ring mechanism, and plasma processing device using the ring mechanism
US7882800B2 · kind B2 · utility
19Cited by
14References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2002 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Aug 12, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/915
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A ring mechanism, comprising a focus ring and divided cover rings surrounding a wafer W placed on a loading table (lower electrode) mounted in a processing chamber, wherein a ring-shaped clearance δ1 is provided between the divided rings to spread plasma to the radial outside of the focus ring to allow plasma to get therein, whereby a potential difference between the wafer W and the focus ring can be eliminated to prevent arc discharge by plasma from occurring between the wafer W and the focus ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.