Method and device for mutual contacting of two wafers

US7882997B2 · kind B2 · utility

Assignee

• Pac Tech—Packaging Technologies Gmbh · DE

Inventors

• Elke Zakel · Falkensee, DE
• Ghassem Azdasht · Berlin, DE

Key dates

• Filing date: Jul 11, 2005
• Grant date: Feb 8, 2011
• Expiry date: Aug 31, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19043
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14), to produce electronic assemblies on the wafer level, in which the component composite configurations are each situated on a receptacle unit (11; 13) and the contact pressure necessary for the contacting between contact metallizations of the component composite configurations to be connected to one another is generated in such a way that a vacuum is generated in a contact chamber which receives the component composite configurations and is delimited by the receptacle units, and the contacting of the contact metallizations is performed by a rear energy impingement of a component composite configuration.