System and method for removing particles from a polishing pad
US7883393B2 · kind B2 · utility
2Cited by
22References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 8, 2005 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Feb 21, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F1/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser arranged to dispense a fluid on the polishing pad; and removal means, wherein the removal means include a heater for increasing the temperature of the fluid dispensed on the polishing pad, and/or voltage means for coupling the polishing pad to a voltage source for repelling charged particles from the polishing pad surface while the fluid dispenser is dispensing the fluid on the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.