System-in-package and manufacturing method of the same
US7884461B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Feb 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole and a contact conductive via formed therein, a die disposed within the die receiving through hole, a surrounding material filled in the gap except the die area of the die receiving though hole, a re-distribution layer formed on the substrate and coupled to the contact conductive via, a protection layer formed over the re-distribution layer, a cover material formed over the protection layer; and a terminal contact pad formed on the lower surface of the substrate and under the contact conductive via and the die to couple the contact conductive via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.