Semiconductor inspecting device
US7884632B2 · kind B2 · utility
23Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2009 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Feb 12, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06727
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In a semiconductor inspecting device having a contact to be electrically connected to an electrode pad formed in a semiconductor device which is an object to be measured, and a substrate provided with the contact, the contact is provided obliquely to a main surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.