Method for measuring a workpiece using a machine tool
US7886453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Feb 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0405
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is described for measuring a workpiece on a machine tool using an analogue probe having a deflectable stylus. The method comprises the step of taking a workpiece having a nominal surface profile, the workpiece being located within the working area of the machine tool. The machine tool is used to move the analogue probe along a predetermined (known) measurement path relative to the workpiece whilst deflection of the stylus is measured. The analogue probe is moved relative to the workpiece at a speed greater than five millimeters per second and the predetermined measurement path is selected to provide intermittent contact between the stylus and the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.