Microelectromechanical sensor having multiple full-scale and sensitivity values
US7886601B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Nov 26, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microelectromechanical sensing structure is provided with a mobile element adapted to be displaced as a function of a quantity to be detected, and first fixed elements, capacitively coupled to the mobile element and configured to implement with the mobile element first detection conditions. The sensing structure is further provided with second fixed elements, capacitively coupled to the mobile element and configured to implement with the mobile element second detection conditions, which are different from the first detection conditions. In particular, the first and second detection conditions differ with respect to a full-scale or a sensitivity value in the detection of the aforesaid quantity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.