Angelo Merassi
22Patents
8h-index
20Co-inventors
71Inventor score
Filing activity: May 21, 2003 → Jan 5, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6928872B2 | Integrated gyroscope of semiconductor material with at least one sensitive axis in the sensor plane | Physics | 40 | Expired |
| US7322242B2 | Micro-electromechanical structure with improved insensitivity to thermomechanical stresses induced by the package | Physics | 38 | Expired |
| US7886601B2 | Microelectromechanical sensor having multiple full-scale and sensitivity values | Physics | 36 | Active |
| US7252002B2 | Planar inertial sensor, in particular for portable devices having a stand-by function | Electricity | 22 | Expired |
| US7793544B2 | Microelectromechanical inertial sensor, in particular for free-fall detection applications | Physics | 19 | Active |
| US7520171B2 | Micro-electromechanical structure with self-compensation of the thermal drifts caused by thermomechanical stress | Physics | 15 | Active |
| US8124895B2 | Planar microelectromechanical device having a stopper structure for out-of-plane movements | Physics | 14 | Active |
| US6858810B2 | Sensor with failure threshold | Electricity | 10 | Expired |
| US8565452B2 | Integrated acoustic transducer in MEMS technology, and manufacturing process thereof | Emerging Cross-Sectional Technologies | 8 | Active |
| US9878903B2 | Method of manufacturing a temperature-compensated micro-electromechanical device | Emerging Cross-Sectional Technologies | 6 | Active |
| US7646582B2 | Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device | Emerging Cross-Sectional Technologies | 4 | Active |
| US9184138B2 | Semiconductor integrated device with mechanically decoupled active area and related manufacturing process | Electricity | 4 | Active |
| US9340413B2 | Integrated acoustic transducer in MEMS technology, and manufacturing process thereof | Emerging Cross-Sectional Technologies | 3 | Active |
| US8721910B2 | Process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device and spray device using such membrane | Emerging Cross-Sectional Technologies | 3 | Active |
| US8661900B2 | Z-axis microelectromechanical device with improved stopper structure | Physics | 2 | Active |
| US9486593B2 | Process for manufacturing an integrated membrane of nozzles in MEMS technology for a spray device and spray device using such membrane | Emerging Cross-Sectional Technologies | 1 | Active |
| US8733170B2 | Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device | Emerging Cross-Sectional Technologies | 1 | Active |
| US9815687B2 | MEMS device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress | Physics | 1 | Active |
| US7678599B2 | Process for the fabrication of an inertial sensor with failure threshold | Electricity | 0 | Active |
| US10894713B2 | Temperature-compensated micro-electromechanical device, and method of temperature compensation in a micro-electromechanical device | Emerging Cross-Sectional Technologies | 0 | Active |
| US9327962B2 | MEMS device and corresponding micromechanical structure with integrated compensation of thermo-mechanical stress | Physics | 0 | Active |
| US9080871B2 | Microelectromechanical sensor with non-conductive sensing mass, and method of sensing through a microelectromechanical sensor | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.