Laser machining system and method
US7887712B2 · kind B2 · utility
44Cited by
30References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2002 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Mar 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate (16) is machined to form, for example, a via. The substrate is in a chamber (15) within which the gaseous environment is controlled. The machining laser beam (13) is delivered with control of parameters such as pulsing parameters to achieve desired effects. The gaseous environment may be controlled to control integral development of an insulating lining for a via, thereby avoiding the need for downstream etching and oxide growth steps. Also, machining may be performed in multiple passes in order to minimize thermal damage and to achieve other desired effects such as a particular via geometry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.