Multilayer printed circuit board
US7888606B2 · kind B2 · utility
12Cited by
73References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2008 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Feb 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.