Electronic fuse having heat spreading structure
US7888772B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2008 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Jun 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a fuse transistor for fuse programming and a fuse block connected to the fuse transistor, wherein the fuse block comprises a fuse line and a heat spreading structure connected to the fuse line. The electrical fuse employs the heat spreading structure connected to the fuse line to prevent a rupture of the electrical fuse such that heat, which is generated in the fuse line during a blowing of the fuse line, is spread throughout the heat spreading structure. Thus, a sensing margin of the electrical fuse can be secured and a deterioration of devices adjacent to the electrical fuse by heat generated in the electrical fuse can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.