Substrate package with through holes for high speed I/O flex cable
US7888784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2008 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Dec 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly of substrate packages interconnected with flex cables and a method of fabrication of the substrate package. The assembly allows input/output (I/O) signals to be speedily transmitted between substrate packages via flex cable and without being routed through the motherboard. Embodiments relate to a substrate package providing separable inter-package flex cable connection. Hermetically-sealed guiding through holes are provided on the substrate package as a mechanical alignment feature to guide connection between flex cables and high speed I/O contact pads on the substrate package. Embodiments of the method of fabrication relate to simultaneously forming hermetically-sealed guiding through holes and I/O contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.