Semiconductor device and method of manufacturing the same
US7888809B2 · kind B2 · utility
0Cited by
6References
8Claims
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Key dates
| Filing date | Oct 22, 2009 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Oct 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.