Printing in a medium
US7891295B2 · kind B2 · utility
1Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2008 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Oct 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.