Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
US7892651B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 13, 2005 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Jan 29, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composite metal foil comprising a metal foil and a layer of a block copolymer polyimide resin formed on one surface of the metal foil, a metal-foil-clad laminate using the above resin composite metal foil, a printed wiring board using the above metal-foil-clad laminate, and a process for the production of a printed wiring board comprising removing an external layer metal foil of a metal-foil-clad laminate and forming a conductor layer on an external layer insulating layer by plating, wherein the metal-foil-clad laminate comprises a layer of a block copolymer polyimide resin which layer is in contact with the external layer metal foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.