Thermoelectric 3D cooling
US7893529B2 · kind B2 · utility
23Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2009 |
| Grant date | Feb 22, 2011 |
| Priority date | — |
| Expiry date | Jan 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.