Carbon filament memory and fabrication method

US7894253B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Franz Kreupl · Mountain View, US
• Michael Kund · Bad Aibling, DE
• Klaus-Dieter Ufert · Unterschleißheim, DE

Key dates

• Filing date: Feb 20, 2007
• Grant date: Feb 22, 2011
• Expiry date: Dec 4, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/30

Abstract

An integrated circuit is described, including a memory element including a first carbon layer rich in a first carbon material and a second carbon layer rich in a second carbon material. The memory element stores information by reversibly forming a conductive channel in the second carbon layer, wherein the conductive channel includes the first carbon material.