Method for manufacturing multilayer flexible printed circuit board
US7897055B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2007 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Aug 25, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.