Method for plating flexible printed circuit board
US7897199B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2008 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Jun 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.