Process for packaging micro-components using a matrix

US7897436B2 · kind B2 · utility

Assignees

• STMicroelectronics SA
• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

• Guillaume Bouche · Albany, US
• Bernard Andre · Grenoble, FR
• Nicolas Sillon · Fontaine, FR

Key dates

• Filing date: Nov 28, 2005
• Grant date: Mar 1, 2011
• Expiry date: Jul 29, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/01079
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A process for packaging a number of micro-components on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a covering plate comprising a re-useable matrix, a polymer layer, and a metal layer; covering the wafer with the covering plate; applying a contact pressure equal to at least one bar on the covering plate and on the wafer; heating the metal layer during pressing until sealing is obtained, each cavity thus being provided with a sealing area and closed by metal layer; and dissolving the polymer to recover and recycle the matrix.