Substrate heating apparatus, heating method, and semiconductor device manufacturing method
US7897523B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 27, 2009 |
| Grant date | Mar 1, 2011 |
| Priority date | — |
| Expiry date | Sep 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate heating apparatus having a conductive heater which heats a substrate includes a filament arranged in the conductive heater and connected to a filament power supply to generate thermoelectrons, and an acceleration power supply which accelerates the thermoelectrons between the filament and conductive heater. The filament has inner peripheral portions formed at a predetermined interval along an inner circle concentric with the substrate, outer peripheral portions formed at a predetermined interval on an outer circle concentric with the inner circle and having a diameter larger than that of the inner circle, and a region formed by connecting the end point of each inner peripheral portions and the end point of a corresponding one of the outer peripheral portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.