Patent · US Active

Arrangement for hermetically sealing components, and method for the production thereof

US7897881B2 · kind B2 · utility

10Cited by

4References

41Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Michael Kaspar · Putzbrunn, DE
Herbert Schwarzbauer · Munich, DE
Karl Weidner · Birkenfeld, DE

Key dates

Filing date	Jul 28, 2006
Grant date	Mar 1, 2011
Priority date	—
Expiry date	Sep 9, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/10
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.