Conductive ball mounting apparatus and conductive ball mounting method
US7900807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2010 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Mar 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1581
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.