Surface roughening method for light emitting diode substrate
US7901963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2008 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Aug 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/82
Abstract
The present invention discloses a surface roughening method for an LED substrate, which uses a grinding technology and an abrasive paper of from No. 300 to No. 6000 to grind the surface of a substrate to form a plurality of irregular concave zones and convex zones on the surface of the substrate. Next, a semiconductor light emitting structure is formed on the surface of the substrate. The concave zones and convex zones can scatter and diffract the light inside LED, reduce the horizontally-propagating light between the substrate and the semiconductor layer, decrease the probability of total reflection and promote LED light extraction efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.