Method for forming a package-on-package structure
US7901988B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2008 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Jan 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a package-on-package structure is disclosed. The method comprises the step of providing a first semiconductor package. The first semiconductor package has at least one encapsulation layer formed on at least one side of the first semiconductor package. The method also involves the step of securing the first semiconductor package to a surface. The surface is adapted for receiving the first semiconductor package. The method further involves the step of reducing the thickness of the at least one encapsulation layer to a predetermined thickness. The at least one encapsulation layer having a portion distal the surface removed. More specifically, the thickness of the at least one encapsulation layer is reduced for providing a predetermined clearance from a second semiconductor package attachable to the first semiconductor package. The clearance is the distance between the at least one encapsulation layer of the first semiconductor package and a side of the second semiconductor package opposing thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.