Determining locations on a wafer to be reviewed during defect review
US7904845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2007 |
| Grant date | Mar 8, 2011 |
| Priority date | — |
| Expiry date | Mar 1, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7065
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various methods, designs, defect review tools, and systems for determining locations on a wafer to be reviewed during defect review are provided. One computer-implemented method includes acquiring coordinates of defects detected by two or more inspection systems. The defects do not include defects detected on the wafer. The method also includes determining coordinates of the locations on the wafer to be reviewed during the defect review by translating the coordinates of the defects into the coordinates on the wafer such that results of the defect review performed at the locations can be used to determine if the defects cause systematic defects on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.