Ultrasonic bonding apparatus
US7905268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2009 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Sep 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.