Jun Matsueda
4Patents
1h-index
6Co-inventors
27Inventor score
Filing activity: Sep 22, 2009 → Nov 12, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7905268B2 | Ultrasonic bonding apparatus | Electricity | 1 | Active |
| US7938160B2 | Ultrasonic bonding apparatus | Electricity | 1 | Active |
| US7823618B2 | Ultrasonic bonding apparatus | Electricity | 1 | Active |
| US8065793B2 | Method of encapsulating an electronic component | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.