Method of forming a surface micromachined MEMS device
US7906359B2 · kind B2 · utility
2Cited by
17References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2003 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Nov 24, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/0802
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming a surface micromachined MEMS device applies an insulator to a substrate, and then deposits a conductive path on the insulator. The conductive path is capable of transmitting an electronic signal between two points on the MEMS device. The insulator electrically isolates the conductive path from the substrate. The MEMS device illustratively is free of semiconductor junctions formed by the substrate and the conductive path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.