Structure of circuit board and method for fabricating same
US7906850B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2006 |
| Grant date | Mar 15, 2011 |
| Priority date | — |
| Expiry date | Sep 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board structure and a method for fabricating the same are proposed. The structure includes an insulating protective layer having a plurality of openings in which conductive vias are formed, a patterned circuit layer formed on the surface of the insulating protective layer and electrically connected to the conductive vias in the openings of the insulating protective layer, and a dielectric layer formed on the insulating protective layer and on the surface of the patterned circuit layer, wherein a plurality of openings are formed in the dielectric layer to thereby expose parts of the patterned circuit layer. Accordingly, the present invention reduces the thickness of a circuit board, which reduces package size, improves product performance, and conforms to the developmental trend toward smaller electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.