Method of manufacturing multi-layer printed circuit board
US7908745B2 · kind B2 · utility
4Cited by
77References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2008 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Jan 31, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the intermediate layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.