Release layer for in-mold decoration
US7910205B2 · kind B2 · utility
3Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2008 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Jun 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a composition suitable for the formation of a release layer in an in-mold decoration or thermal transfer printing process. The invention also relates to a process for the formation of a release layer comprising dispersing or dissolving the release layer composition of the present invention in a solvent followed by curing said composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.