Semiconductor device having adhesion increasing film to prevent peeling
US7910405B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 12, 2007 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Sep 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.