Wiring board, semiconductor device using wiring board and their manufacturing methods
US7911038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2007 |
| Grant date | Mar 22, 2011 |
| Priority date | — |
| Expiry date | Aug 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.