Patent · US Active

Pressure sensor including thermal selftest

US7918135B2 · kind B2 · utility

15Cited by

5References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Dirk Hammerschmidt · Villach, AT

Key dates

Filing date	Feb 3, 2009
Grant date	Apr 5, 2011
Priority date	—
Expiry date	Feb 14, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG01L27/007
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A semiconductor device includes a diaphragm, a sensing element, and a circuit. The sensing element is configured to sense deflection of the diaphragm. The circuit is configured to heat the diaphragm to induce deflection of the diaphragm.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.