Wire bonding deflector for a wire bonder
US7918378B1 · kind B1 · utility
12Cited by
15References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2010 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Aug 6, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S228/904
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.