Semiconductor device with a light emitting semiconductor die
US7919787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2007 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Dec 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.