Formation of a hybrid integrated circuit device
US7919845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2007 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | May 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Formation of a hybrid integrated circuit device is described. A design for the integrated circuit is obtained and separated into at least two portions responsive to component sizes. A first die is formed for a first portion of the hybrid integrated circuit device using at least in part a first minimum dimension lithography. A second die is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die has the second minimum dimension lithography as a smallest lithography used for the forming of the second die. The first die and the second die are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.