Semiconductor module with two cooling surfaces and method
US7919854B2 · kind B2 · utility
12Cited by
2References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2008 |
| Grant date | Apr 5, 2011 |
| Priority date | — |
| Expiry date | Apr 18, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.