Pattern forming apparatus and manufacturing apparatus using the same
US7921799B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2006 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | May 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pattern forming apparatus comprises a surface treatment system and an ink jet system 14, where a solvent is sprayed from a solvent spray nozzle of the surface treatment system to surface of a glass substrate where a bus line pattern groove is formed. The ink is discharged from an ink discharge nozzle of the ink jet system into the groove of bus line pattern on a glass substrate, and a bus line pattern is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.