Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor
US7922297B2 · kind B2 · utility
1Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2007 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Jul 17, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/13
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A silicon chip has a plurality of ink jetting structures. Each ink jetting structure of the plurality of ink jetting structures includes a heater stack having an electrical heater element. A power transistor is electrically connected to the electrical heater element. A planarization layer is interposed between the power transistor and the heater stack. The planarization layer has a planar base surface on which the heater stack is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.