Inventor · Georgetown, KY, US

Timothy Strunk

31Patents
11h-index
33Co-inventors
75Inventor score

Filing activity: Mar 4, 1985 → Apr 11, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US4744041A Method for testing DC motors Physics 122 Expired
US8814293B2 On-chip fluid recirculation pump for micro-fluid applications Performing Operations; Transporting 27 Active
US6871926B2 Method of estimating an amount of available ink contained in an ink reservoir Performing Operations; Transporting 22 Expired
US7280772B2 Method for detecting whether a cartridge installed in an imaging apparatus is potentially counterfeit Physics 20 Expired
US7788490B2 Methods for authenticating an identity of an article in electrical communication with a verifier system Electricity 18 Active
US6242883A Variable speed three-phase motor drive with two inverter circuits Electricity 18 Expired
US5406185A Two-phase inverter drive for a three-phase motor Electricity 14 Expired
US7585043B2 Method of authenticating a consumable Electricity 13 Expired
US7589850B2 Licensing method for use with an imaging device Physics 13 Expired
US7240995B2 Method of authenticating a consumable Electricity 11 Expired
US7258411B2 Method of informing a user of end of life of a consumable for an ink jet printer Performing Operations; Transporting 11 Expired
US7798594B2 Method of authenticating a consumable Electricity 10 Active
US7376627B2 Method of licensing functionality after initial transaction Physics 10 Expired
US7689513B2 Method of licensing functionality after initial transaction Physics 10 Active
US7369782B2 Method and system for providing technical support relating to an imaging cartridge Physics 9 Expired
US6962399B2 Method of warning a user of end of life of a consumable for an ink jet printer Performing Operations; Transporting 7 Expired
US9630419B2 Maintenance valve for fluid ejection head Performing Operations; Transporting 5 Active
US8459779B2 Heater chips with silicon die bonded on silicon substrate, including offset wire bonding Performing Operations; Transporting 3 Active
US6127791A Electric drive system and method Emerging Cross-Sectional Technologies 3 Expired
US8087756B2 Heater chips with silicon die bonded on silicon substrate Emerging Cross-Sectional Technologies 3 Active
US7938513B2 Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips Emerging Cross-Sectional Technologies 2 Active
US7629742B2 Electroluminescent displays, media, and members, and methods associated therewith Electricity 2 Active
US7959261B2 Micro-fluid ejection devices having reduced input/output addressable heaters Emerging Cross-Sectional Technologies 1 Active
US7922297B2 Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor Performing Operations; Transporting 1 Active
US8882221B2 Modular micro-fluid ejection head assembly Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.