Fabrication of composite materials using atomic layer deposition
US7923068B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2008 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Nov 20, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of constructing composite films including particles embedded in a filler matrix involve preparing a collection of stacked particles, then depositing a matrix material throughout the particle collection using an atomic layer deposition (ALD) method so as to substantially completely fill the spaces between the particles with the matrix material. During matrix deposition, a vapor phase etch cycle may be periodically employed to avoid clogging of small pores in the particle collection. New composite materials formed by such methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.