Image sensor module and fabrication method thereof
US7923793B2 · kind B2 · utility
22Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2008 |
| Grant date | Apr 12, 2011 |
| Priority date | — |
| Expiry date | Jul 10, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor module having a sensor chip closely adhered on a concave surface and a fabrication method thereof are disclosed. The image sensor module includes at least one sensor chip, at least one sensor chip-mounting structure comprising a substrate and a polymer layer formed on the substrate, the polymer layer having an concave surface formed on an upper part thereof by a polymer molding method, so that the sensor chip is bent and bonded on the concave surface, and at least one lens fixed on the at least one sensor chip-mounting structure above the sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.